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SA56004X
1 C accurate, SMBus-compatible, 8-pin, remote/local digital temperature sensor with overtemperature alarms
Rev. 05 -- 22 May 2008 Product data sheet
1. General description
The NXP Semiconductors SA56004X is an SMBus compatible, 11-bit remote/local digital temperature sensor with overtemperature alarms. The remote channel of the SA56004X monitors a diode junction, such as a substrate PNP of a microprocessor or a diode connected transistor such as the 2N3904 (NPN) or 2N3906 (PNP). With factory trimming, remote sensor accuracy of 1 C is achieved. Undertemperature and overtemperature alert thresholds can be programmed to cause the ALERT output to indicate when the on-chip or remote temperature is out of range. This output may be used as a system interrupt or SMBus alert. The T_CRIT output is activated when the on-chip or remote temperature measurement rises above the programmed T_CRIT threshold register value. This output may be used to activate a cooling fan, send a warning or trigger a system shutdown. To further enhance system reliability, the SA56004X employs an SMBus time-out protocol. The SA56004X has a unique device architecture. The SA56004X is available in the SO8, TSSOP8 and HVSON8 packages. SA56004X has 8 factory-programmed device address options. The SA56004X is pin-compatible with the LM86, MAX6657/8, and ADM1032.
2. Features
I Accurately senses temperature of remote microprocessor thermal diodes or diode connected transistors within 1 C I On-chip local temperature sensing within 2 C I Temperature range of -40 C to +125 C I 11-bit, 0.125 C resolution I 8 different device addresses are available for server applications. The SA56004ED with marking code 56004E, and SA56004EDP with marking code 6004E are address compatible with the National LM86, the MAX6657/8 and the ADM1032. I Offset registers available for adjusting the remote temperature accuracy I Programmable under/overtemperature alarms: ALERT and T_CRIT I SMBus 2.0 compatible interface, supports TIMEOUT I Operating voltage range: 3.0 V to 3.6 V I I2C-bus Standard-mode and Fast-mode compatible I SO8, TSSOP8 and HVSON8 packages I Programmable conversion rate (0.0625 Hz to 26 Hz) I Undervoltage lockout prevents erroneous temperature readings I Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
3. Applications
I I I I I System thermal management in laptops, desktops, servers and workstations Computers and office electronic equipment Electronic test equipment and instrumentation HVAC Industrial controllers and embedded systems
4. Ordering information
Table 1. Ordering information Package Name SA56004AD SA56004BD SA56004CD SA56004DD SA56004ED SA56004FD SA56004GD SA56004HD SA56004ADP SA56004BDP SA56004CDP SA56004DDP SA56004EDP SA56004FDP SA56004GDP SA56004HDP SA56004ATK SA56004ETK SA56004FTK
[1] There are 8 device slave address options, as described in Table 2.
Type number[1]
Description plastic small outline package; 8 leads; body width 3.9 mm
Version SOT96-1
SO8
TSSOP8
plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
HVSON8
plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm
SOT782-1
4.1 Ordering options
Table 2. Ordering options Topside mark 56004A 6004A 6004A 56004B 6004B 1001 001 Device slave address[1] 1001 000 Type number SA56004AD SA56004ADP SA56004ATK SA56004BD SA56004BDP
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Product data sheet
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NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
Ordering options ...continued Topside mark 56004C 6004C 56004D 6004D 56004E 6004E 6004E 56004F 6004F 6004F 56004G 6004G 56004H 6004H 1001 111 1001 110 1001 101 1001 100 1001 011 Device slave address[1] 1001 010
Table 2.
Type number SA56004CD SA56004CDP SA56004DD SA56004DDP SA56004ED[2] SA56004EDP[2] SA56004ETK[2] SA56004FD SA56004FDP SA56004FTK SA56004GD SA56004GDP SA56004HD SA56004HDP
[1] [2]
The device slave address is factory programmed in OTP device address register. The SA56004ED/EDP/ETK has the bus address of the National LM86, MAX6657/8 and the ADM1032.
5. Block diagram
SA56004X
VDD LOCAL TEMP SENSOR
ONE-SHOT REGISTER REMOTE OFFSET REGISTER CONVERSION REGISTER LOCAL TEMP DATA REGISTER REMOTE TEMP DATA REGISTER T_CRIT HYSTERESIS CONFIGURATION REGISTER LOCAL HIGH TEMP THRESHOLD LOCAL LOW TEMP THRESHOLD REMOTE HIGH TEMP THRESHOLD REMOTE LOW TEMP THRESHOLD COMMAND REGISTER LOCAL TEMP HIGH LIMIT REGISTER LOCAL TEMP LOW THRESHOLD REMOTE TEMP HIGH LIMIT REG. REMOTE TEMP LOW LIMIT REG.
CONTROL LOGIC
D+ D-
LOCAL REMOTE MUX
11-BIT - A-to-D CONVERTER
ALERT
ALERT INTERRUPT STATUS REGISTER
GND T_CRIT T_CRIT INTERRUPT OTP DEVICE ADDRESS REGISTER SMBus INTERFACE
002aad202
SDATA
SCLK
Fig 1.
SA56004X_5
Block diagram
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Product data sheet
Rev. 05 -- 22 May 2008
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NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
6. Pinning information
6.1 Pinning
VDD D+ D- T_CRIT
1 2
8 7
SCLK VDD SDATA ALERT GND 1 2 3 4
002aad199
8 7
SCLK SDATA ALERT GND
SA56004XD
3 4
002aad198
D+ D- T_CRIT
6 5
SA56004XDP
6 5
Fig 2.
Pin configuration for SO8
terminal 1 index area VDD D+ D- T_CRIT 1 2
Fig 3.
Pin configuration for TSSOP8
8 7
SCLK SDATA ALERT GND
SA56004XTK
3 4 6 5
002aad200
Transparent top view
Fig 4.
Pin configuration for HVSON8
6.2 Pin description
Table 3. Symbol VDD D+ D- T_CRIT GND ALERT Pin description Pin 1 2 3 4 5 6 Description Positive supply voltage. DC voltage from 3.0 V to 5.5 V. Diode current source (anode). Diode sink current (cathode). T_CRIT alarm is open-drain, active LOW output which requires an external pull-up resistor. It functions as a system interrupt or power shutdown. Power supply ground. ALERT alarm is an open-drain, active LOW output which requires an external pull-up resistor. It functions as an interrupt indicating that the temperature of the on-chip or remote diode is above or below programmed overtemperature or undertemperature thresholds. SMBus/I2C-bus bidirectional data line. This is an open-drain output which requires an external pull-up resistor. SMBus/I2C-bus clock input which requires an external pull-up resistor.
SDATA SCLK
7 8
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Product data sheet
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NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
7. Functional description
Refer to Figure 1 "Block diagram".
7.1 Serial bus interface
The SA56004X should be connected to a compatible two-wire serial interface System Management Bus (SMBus) as a slave device using the two device terminals SCLK and SDATA. The ALERT pin can optionally be used with the SMBus protocol to implement the ARA response. The controller will provide a clock signal to the device SCLK pin and write/read data to/from the device through the device SDATA pin. External pull-up resistors, about 10 k each, are needed for these device pins due to open-drain circuitry. Data of 8-bit digital byte or word are used for communication between the controller and the device using SMBus 2.0 protocols which are described more in Section 7.10 "SMBus interface". The operation of the device to the bus is described with details in the following sections.
7.2 Slave address
The SA56004X has a 7-bit slave address register which is factory programmed in OTP memory. Eight unique devices are available with different slave addresses as defined in Table 2 "Ordering options". Up to eight devices can reside on the same SMBus without conflict, provided that their addresses are unique.
7.3 Register overview
The SA56004X contains three types of SMBus addressable registers. These are read-only (R), write-only (W), and read-write (R/W). Attempting to write to any R-only register or read data from any W-only register will produce an invalid result. Some of the R/W registers have separate addresses for reading and writing operations. The registers of the SA56004X serve four purposes:
* * * *
Control and configuration of the SA56004X Status reporting Temperature measurement storage ID and manufacturer test registers
Table 4 describes the names, addresses, Power-On Reset (POR), and functions of each register. The data of the temperature-related registers is in 2's complement format in which the MSB is the sign bit. The 8-bit data of other registers is in 8-bit straight format.
SA56004X_5
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Product data sheet
Rev. 05 -- 22 May 2008
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NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
Table 4. Register name LTHB RTHB SR CON CR LHS LLS RHSHB RLSHB One Shot RTLB RTOHB RTOLB RHSLB RLSLB RCS LCS TH ATLB AM RMID RDR
Register assignments Command byte Read address 00h 01h 02h 03h 04h 05h 06h 07h 08h n/a 10h 11h 12h 13h 14h 19h 20h 21h 22h BFh FEh FFh Write address n/a n/a n/a 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh n/a 11h 12h 13h 14h 19h 20h 21h n/a BFh n/a n/a 0000 0000 0000 0000 0000 0000 0000 0000 1000 0100 0110 0000 0000 0100 0110 0000 0000 0000 00 0000 0000 000 000 000 0101 0101 0101 0101 0 1010 0000 0000 0 1010 0001 0000 0000 local temperature high byte remote temperature high byte status register configuration register conversion rate local high setpoint local low setpoint remote high setpoint high byte remote low setpoint high byte writing register initiates a one shot conversion remote temperature low byte remote temperature offset high byte remote temperature offset low byte remote high setpoint low byte remote low setpoint low byte remote T_CRIT setpoint local T_CRIT setpoint T_CRIT hysteresis local temperature low byte Alert mode read manufacturer's ID read stepping or die revision 8 8 8 8 4 8 8 8 8 0 6 (MSBs) 8 3 (MSBs) 3 (MSBs) 3 (MSBs) 8 8 5 3 (MSBs) 1 8 8 R R R R/W R/W R/W R/W R/W R/W W R R/W R/W R/W R/W R/W R/W R/W R R/W R R POR state Function Bits Access
7.4 Power-on reset
When power is applied to the SA56004X, the device will enter into its Power-On Reset (POR) state and its registers are reset to their default values. The configuration, status, and temperature-reading registers remain in these states until after the first conversion. As shown in Table 4 this results in: 1. Command register set to 00h. 2. Local Temperature register (LTHB and LTLB) set to 0 C. 3. Remote Diode Temperature register (RTHB and RTLB) set to 0 C until the end of the first conversion. 4. Status register (SR) set to 00h. 5. Configuration register (CON) set to 00h; interrupt latches are cleared, the ALERT and T_CRIT output drivers are off and the ALERT and T_CRIT pins are pulled HIGH by the external pull-up resistors. 6. Local T_CRIT temperature setpoints (LCS) and Remote T_CRIT temperature setpoints (RCS) at 85 C. 7. Local HIGH setpoint (LHS) and remote HIGH temperature setpoint (RHSHB) at 70 C.
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SA56004X
Digital temperature sensor with overtemperature alarms
8. Local LOW setpoint (LLS) and Remote LOW temperature setpoints (RLSHB) at 0 C. 9. Conversion Rate register (CR) is set to 8h; the default value of about 16 conversions/s.
7.5 Starting conversion
Upon POR, the RUN/STOP bit 6 of the configuration register is zero (default condition), then, the device will enter into its free-running operation mode in which the device A/D converter is enabled and the measurement function is activated. In this mode, the device cycles the measurements of the local and remote temperature automatically and periodically. The conversion rate is defined by the programmable conversion rate stored in the conversion rate register. It also performs comparison between readings and limits of the temperature in order to set the flags and interruption accordingly at the end of every conversion. Measured values are stored in the temp registers, results of the limit comparisons are reflected by the status of the flag bits in the status register and the interruption is reflected by the logical level of the ALERT and T_CRIT output. If the power-on temperature limit is not suitable, the temp limit values could be written into the limit registers during the busy-conversion duration of about 38 ms of the first conversion after power-up. Otherwise, the status register must be read and the configuration bit 7 must be reset in order to recover the device from interruption caused by the undesired temp limits.
7.6 Low power software standby mode
The device can be placed in a software standby mode by setting the RUN/STOP bit 6 in the configuration register HIGH (logic 1). In standby, the free-running oscillator is stopped, the supply current is less than 10 A if there is no SMBus activity, all data in the registers is retained. However, the SMBus is still active and reading and writing registers can still be performed. A one-shot command will initiate a single conversion which has the same effect as any conversion that occurs when the device is in its free-running mode. To restore the device to free running mode, set the RUN/STOP bit 6 LOW (logic 0).
7.7 Temperature data format
The temperature data can only be read from the Local and Remote Temperature registers; the setpoint registers (e.g., T_CRIT, LOW, HIGH) are read/write. Both local and remote temperature reading data is represented by an 11-bit, 2's complement word with the Least Significant Bit (LSB) = 0.125 C. The temperature setpoint data for the remote channel is also represented by an 11-bit, 2's complement word with the LSB = 0.125 C. The temperature setpoint data for both the local channel and the T_CRIT setpoints are represented by 8-bit, 2's complement words with the LSB =1.0 C. For 11-bit temp data, the data format is a left justified, 16-bit word available in two 8-bit registers (high byte and low byte). For 8-bit temp data, the data is available in a single 8-bit register (high byte only).
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Product data sheet
Rev. 05 -- 22 May 2008
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NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
Temperature data format Digital output Binary Hex 7D00h 1900h 0100h 0020h 0000h FFE0h FF00h E700h C900h 0111 1101 0000 0000 0001 1001 0000 0000 0000 0001 0000 0000 0000 0000 0010 0000 0000 0000 0000 0000 1111 1111 1110 0000 1111 1111 0000 0000 1110 0111 0000 0000 1100 1001 0000 0000
Table 5.
Temperature +125 C +25 C +1 C +0.125 C 0 C -0.125 C -1 C -25 C -55 C
7.8 SA56004X SMBus registers
7.8.1 Command register
The command register selects which register will be read or written to. Data for this register should be transmitted during the Command Byte of the SMBus write communication.
7.8.2 Local and remote temperature registers (LTHB, LTLB, RTHB, RTLB)
Table 6. Byte Bit Value LTHB, LTLB, RTHB, RTLB - Local and remote temperature registers High byte (read only; address 00h, 01h) D7 sign D6 64 D5 32 D4 16 D3 8 D2 4 D1 2 D0 1 Low byte (read only; address 10h) D7 0.5 D6 0.25 D5 0.125 D4 0 D3 0 D2 0 D1 0 D0 0
7.8.3 Configuration register (CON)
The configuration register is an 8-bit register with read address 03h and write address 09h. Table 7 shows how the bits in this register are used.
Table 7. Bit 7 CON - Configuration register (read address 03h; write address 09h) bit assignments Description ALERT mask. The ALERT interrupt is enabled when this bit is LOW. The ALERT interrupt is disabled (masked) when this bit is HIGH. 6 RUN/STOP. Standby or run mode control. Running mode is enabled when this bit is LOW. The SA56004X is in standby mode when this bit is HIGH. 5 4 Not defined; defaults to logic 0. Remote T_CRIT mask. The T_CRIT output will be activated by a remote temperature that exceeds the remote T_CRIT setpoint when this bit is LOW. The T_CRIT output will not be activated under this condition when this bit is HIGH. 3 Not defined; defaults to logic 0. 0 0 0 0 POR state 0
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SA56004X
Digital temperature sensor with overtemperature alarms
CON - Configuration register (read address 03h; write address 09h) bit assignments ...continued Description Local T_CRIT mask. The T_CRIT output will be activated by a local temperature that exceeds the local T_CRIT setpoint when this bit is LOW. The T_CRIT output will not be activated under this condition when this bit is HIGH. POR state 0
Table 7. Bit 2
1 0
Not defined; defaults to logic 0. Fault queue. A single remote temperature measurement outside the HIGH, LOW or T_CRIT setpoints will trigger an outside limit condition resulting in setting the status bits and associated output pins when this bit is LOW. Three consecutive measurements outside of one of these setpoints are required to trigger an outside of limit condition when this bit is HIGH.
0 0
7.8.4 Status register (SR)
The contents of the status register reflect condition status resulting from all activities: comparison between temperature measurements and temperature limits, the status of A/D conversion, and the hardware condition of external diode to the device. Bit assignments are listed in Table 8. This register is read-only and its address is 02h. Upon POR, all bits are set to zero. Remark: Any one of the fault conditions, with the exceptions of Diode OPEN and A/D BUSY, introduces an Alert interrupt (see Section 7.9.1.2). Also, whenever a one-shot command is executed, the status byte should be read after the conversion is completed, which is about 38 ms (1 conversion time period) after the one-shot command is sent.
Table 8. Bit 7 6 5 4 3 2 1 0 SR - Status register (read-only address 02h) bit assignments Description When logic 1, A/D is busy converting. POR state = n/a. When logic 1, indicates local HIGH temperature alarm. POR state = 0. When logic 1, indicates a local LOW temperature alarm. POR state = 0. When logic 1, indicates a remote diode HIGH temperature alarm. POR state = 0. When logic 1, indicates a remote diode LOW temperature alarm. POR state = 0. When logic 1, indicates a remote diode disconnect. POR state = 0. When logic 1, indicates a remote diode critical temperature alarm. POR state = 0. When logic 1, indicates a local critical temperature alarm. POR state = 0.
Name BUSY LHIGH LLOW RHIGH RLOW OPEN RCRIT LCRIT
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SA56004X
Digital temperature sensor with overtemperature alarms
7.8.5 Conversion rate register (CR)
The conversion rate register is used to store programmable conversion data, which defines the time interval between conversions in the standard free-running auto convert mode. Table 9 shows all applicable data values and rates for the SA56004X. Only the 4 LSBs of the register are used and the other bits are reserved for future use. The register is R/W using the read address 04h and write address 0Ah. The POR default conversion data is 08h.
Table 9. Data value 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah to FFh Conversion rate control byte (CR) Conversion rate (Hz) 0.06 0.12 0.25 0.50 1.0 2 4 8 16 32 n/a
7.8.6 Temperature limit registers
Table 10. Byte Bit Value
[1] [2]
LHS, RHSHB, RHSLB - Local and remote HIGH setpoint registers High byte (read only address 05h, 07h; write address 0Bh, 0Dh)[1] D7 sign D6 64 D5 32 D4 16 D3 8 D2 4 D1 2 D0 1 Low byte (read/write address 13h)[2] D7 0.5 D6 0.25 D5 0.125 D4 0 D3 0 D2 0 D1 0 D0 0
POR default LHS = RHSHV = 46h (70 C). POR default RHSLB = 00h.
Table 11. Byte Bit Value
[1] [2]
LLS, RLSHB, RLSLB - Local and remote LOW setpoint registers High byte (read address 06h, 08h; write address 0Ch, 0Eh)[1] D7 sign D6 64 D5 32 D4 16 D3 8 D2 4 D1 2 D0 1 Low byte (read/write address 14h)[2] D7 0.5 D6 0.25 D5 0.125 D4 0 D3 0 D2 0 D1 0 D0 0
POR default LLS = RLSHV = 00h. POR default RLSLB = 00h (0 C).
Table 12. Byte Bit Value
[1]
SA56004X_5
LCS, RCS - Local and remote T_CRIT registers Single high byte (read/write address 20h, 19h)[1] D7 sign D6 64 D5 32 D4 16 D3 8 D2 4 D1 2 D0 1
POR default LCS = RCS = 55h (85 C).
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SA56004X
Digital temperature sensor with overtemperature alarms
TH - T_CRIT hysteresis register Single high byte (read/write address 21h)[1] D7 D6 D5 D4 16 D3 8 D2 4 D1 2 D0 1
Table 13. Byte Bit Value
[1]
POR default TH = 0Ah (10 C).
7.8.7 Programmable offset register (remote only)
Table 14. Byte Bit Value
[1] [2]
RTOHB, RTOLB - Remote temperature offset registers High byte (read/write address 11h)[1] D7 sign D6 64 D5 32 D4 16 D3 8 D2 4 D1 2 D0 1 Low byte (read/write address 12h)[2] D7 0.5 D6 0.25 D5 0.125 D4 0 D3 0 D2 0 D1 0 D0 0
POR default RTOHB = RTOLB = 00h. POR default RTOLB = 00h.
7.8.8 ALERT mode register (AM)
Table 15. AM - ALERT mode register Read and write address BFh. Bit Value D7 0 D6 0 D5 0 D4 0 D3 0 D2 0 D1 0 D0 ALERT mode
D[7:1] is not defined and defaults to logic 0. D0: The ALERT output is in interrupt mode when this bit is LOW. The ALERT output is in comparator mode when this bit is HIGH.
7.8.9 Other registers
The Manufacturers ID register has a default value A1h (1010 0001) and a read address FEh. The Die Revision Code register has a default value 00h (0000 0000) and read address FFh. This register will increment by 1 every time there is a revision to the die.
7.8.10 One-shot register
The one-shot register is used to initiate a single conversion and comparison cycle when the device is in the standby mode; upon completion of the single conversion cycle, the device returns to the standby mode. It is not a data register; it is the write operation that causes the one-shot conversion. The data written to this register is not stored; an FFh value will always be read from this register. To initiate a one-shot operation, send a standard write command with the command byte of 0Fh (One-Shot Write Address).
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SA56004X
Digital temperature sensor with overtemperature alarms
7.9 Interruption logic and functional description
7.9.1 ALERT output
The ALERT output is used to signal Alert interruptions from the device to the SMBus or other system interrupt handler and it is active LOW. Because this is an open-drain output, a pull-up resistor (typically 10 k) to VDD is required. Several slave devices can share a common interrupt line on the same SMBus. The ALERT function is very versatile and accommodates three separate operating modes:
* Temperature comparator * System interrupt based on temperature * SMBus Alert Response Address (ARA) response.
The ARA and interrupt modes are different only in how the user interacts with the SA56004X. At the end of every temperature reading, digital comparators determine if the readings are above the HIGH or T_CRIT setpoint or below the LOW setpoint register values. If so, the corresponding bit in the Status register is set. If the ALERT mask bit 7 of the Configuration register is not HIGH, then any bit set in the Status register other than the BUSY (D7) and OPEN (D2) will cause the ALERT output pin to be active LOW. An alert will be triggered after any conversion cycle that finds the temperature is out of the limits defined by the setpoint registers. In order to trigger an ALERT in all alert modes, the ALERT mask bit 7 of the Configuration register must be cleared (not HIGH). 7.9.1.1 ALERT output in comparator mode When operating the SA56004X in a system that utilizes an SMBus controller not having an interrupt, the ALERT output may be operated as a temperature comparator. In this mode, when the condition that triggered the ALERT to be asserted is no longer present, the ALERT output is released as it goes HIGH. In order to use the ALERT output as a temperature comparator, bit D0 (the ALERT configure bit) in the ALERT Mode (AM) register must be set HIGH. This is not the POR default. 7.9.1.2 ALERT output in interrupt mode In the interrupt mode, the ALERT output is used to provide an interrupt signal that remains asserted until the interrupt service routine has elapsed. In the interrupt operating mode, a read of the Status register will set the ALERT mask bit 7 of the Configuration register if any of the temperature alarm bits of the Status register is set, with exception of BUSY (D7) and OPEN (D2). This protocol prevents further ALERT output triggering until the master device has reset the ALERT mask bit at the end of the interrupt service routine. The Status register bits are cleared only upon a read of the Status register by the serial bus master (see Figure 5). In order for the ALERT output to be used as an interrupt, the ALERT Configure bit D0 of the ALERT Mode (AM) register must be set LOW (POR default).
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SA56004X
Digital temperature sensor with overtemperature alarms
remote temperature high limit
remote diode temperature
ALERT pin
status register bit 4 (RHIGH)
A
B, C
D
E, F
002aad216
Fig 5.
ALERT output in interrupt mode
The following events summarize the ALERT output interrupt mode of operation: Event A: Master senses ALERT output being active-LOW. Event B: Master reads the SA56004X Status register to determine what cause the ALERT interrupt. Event C: SA56004X clears the Status register, resets the ALERT output HIGH, and sets the ALERT mask bit 7 in the Configuration register. Event D: A new conversion result indicates the temperature is still above the high limit, however the ALERT pin is not activated due to the ALERT mask. Event E: Master should correct the conditions that caused the ALERT output to be triggered. For instance, the fan is started, setpoint levels are adjusted. Event F: Master resets the ALERT mask bit 7 in the Configuration register. 7.9.1.3 ALERT output in SMBus ALERT mode When several slave devices share a common interrupt line, an SMBus alert line is implemented. The SA56004X is designed to accommodate the Alert interrupt detection capability of the SMBus 2.0 Alert Response Address (ARA) protocol, defined in SMBus specification 2.0. This procedure is designed to assist the master in resolving which slave device generated the interrupt and in servicing the interrupt while minimizing the time to restore the system to its proper operation. Basically, the SMBus provides Alert response interrupt pointers in order to identify slave devices which have caused the Alert interrupt. When the ARA command is received by all devices on the SMBus, the devices pulling the SMBus alert line LOW send their device addresses to the master; await an acknowledgement and then release the alert line. This requirement to disengage the SMBus alert line prevents locking up the alert line. The SA56004X complies with this ARA disengagement protocol by setting the ALERT mask bit 7 in the Configuration register at address 09h after successfully sending out its address in response to an ARA command and releasing the ALERT output. Once the mask bit is activated, the ALERT output will be disabled until enabled by software. In order to enable the ALERT the master must read the
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SA56004X
Digital temperature sensor with overtemperature alarms
Status register, at address 02h, during the interrupt service routine and then reset the ALERT mask bit 7 in the Configuration register to logic 0 at the end of the interrupt service routine (see Figure 6). In order for the SA56004X to respond to the ARA command, the bit D0 in the ALERT mode register must be set LOW. ALERT mask bit 7 and the ALERT mode bit D0 are both LOW for the POR default.
remote temperature high limit
remote diode temperature temperature ALERT pin
status register bit 4 (RHIGH)
A
B
C
D
002aad215
Fig 6.
ALERT pin in SMBus Alert mode
The following events summarize the ALERT output interrupt operation in the SMBus Alert mode: Event A: Master senses the ALERT line being LOW. Event A to B: Master sends a read command using the common 7-bit Alert Response Address (ARA) of 0001100. Event A to B: Alerting device(s) return ACK signal and their addresses using the I2C-bus Arbitration (the device with the lowest address value sends its address first. The master can repeat the alert reading process and work up through all the interrupts). Event B: Upon the successful completion of returning address, the SA56004X resets its ALERT output (to OFF) and sets the ALERT mask bit 7 in its configuration register. Event C: Master should read the device status register to identify and correct the conditions that caused the Alert interruption. The status register is reset. Event D: Master resets the ALERT mask bit 7 in the configuration register to enable the device ALERT output interruption. Remark: The bit assignment of the returned data from the ARA reading is listed in Table 16. If none of the devices on the bus is alerted then the returned data from ARA reading will be FFh (1111 1111).
SA56004X_5
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 -- 22 May 2008
14 of 36
NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
ALERT response bit assignment Device address bit ADD6 ADD5 ADD4 ADD3 ADD2 ADD1 ADD0 1 Function address bit 6 (MSB) of alerted device address bit 5 of alerted device address bit 4 of alerted device address bit 3 of alerted device address bit 2 of alerted device address bit 1 of alerted device address bit 0 of alerted device always logic 1
Table 16. 7 (MSB) 6 5 4 3 2 1 0
ALERT response bit
7.9.2 T_CRIT output
The T_CRIT output is LOW when any temperature reading is greater than the preset limit in the corresponding critical temperature setpoint register. When one of the T_CRIT setpoint temperatures is exceeded, the appropriate status register bit, 1 (RCRIT) or 0 (LCRIT), is set. After every local and remote temperature conversion the status register flags and the T_CRIT output are updated. Figure 7 is a timing diagram showing the relationship of T_CRIT output, Status bit 1 (RCRIT) and the remote critical temperature setpoint (RCS), and critical temperature hysteresis (TH) with remote temperature changes. Note that the T_CRIT output is de-activated only after the remote temperature is below the remote temperature setpoint, RCS minus the hysteresis, TH. In the interrupt mode only, the Status register flags are reset after the Status register is read.
RCS remote temperature RCS - TH
Status register bit 1 (RCRIT)
T_CRIT output
A
B
C
002aad217
Fig 7.
T_CRIT temperature response timing
Event A: T_CRIT goes LOW and Status bit 1 (RCRIT) is set HIGH when Remote Temperature exceeds RCS, Remote T_CRIT Setpoint. Event B: Remote Temperature goes below RCS - TH. T_CRIT is de-activated, but Status register remains unchanged.
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Product data sheet
Rev. 05 -- 22 May 2008
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NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
Event C: The Status register bit 1 (RCRIT) is reset by a read of the Status register (in the interrupt mode).
7.9.3 Fault Queue
To suppress erroneous ALERT or T_CRIT triggering, the SA56004X implements a Fault Queue for both local and remote channel. The Fault Queue insures a temperature measurement is genuinely beyond a HIGH, LOW or T_CRIT setpoint by not triggering until three consecutive out-of-limit measurements have been made. The fault queue defaults OFF upon POR and may be activated by setting bit 0 in the Configuration register (address 09h) to logic 1.
remote temperature
RCS RCS - TH
remote HIGH setpoint
remote LOW setpoint
ALERT output
T_CRIT output
events
A
B
C
D
E
F
G
H
I
002aad218
Remark: All events indicate the completion of a conversion.
Fig 8.
Fault queue remote HIGH and LOW and T_CRIT, T_CRIT hysteresis setpoint response (comparator mode)
Event A: The remote temperature has exceeded the Remote HIGH setpoint. Event B: Three consecutive over limit measurements have been made exceeding the Remote HIGH setpoint; the ALERT output is activated (goes LOW). By now, the remote temp has exceeded the Remote T_CRIT setpoint (RCS). Event C: Three consecutive over limit measurements have been made exceeding RCS; the T_CRIT output is activated (goes LOW). Event D: The remote temperature falls below the RCS - TH setpoint. Event E: The ALERT output is de-activated (goes HIGH) after a below_high_limit temperature measurement is completed.
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Product data sheet
Rev. 05 -- 22 May 2008
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NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
Event F: Three consecutive measurements have been made with the remote temperature below the RCS - TH threshold; the T_CRIT output is de-activated (goes HIGH). Event G: The remote temp falls below the Remote LOW setpoint. Event H: Three consecutive measurements are made with the temp below the Remote LOW setpoint; ALERT output is activated (goes LOW). Event I: The ALERT output is de-activated (goes HIGH) after a above_low_limit temperature measurement is completed.
7.9.4 Remote diode selection
To measure the remote temperature or the temperature of an externally attached diode, the device automatically forces two successive currents of about 160 A and 10 A at D+ pin. It measures the voltage (VBE) between D+ and D-, detects the difference between the two VBE voltages or the VBE and then converts the VBE into a temperature data using the basic PTAT voltage formula as shown in Equation 1. The device typically takes about 38 ms to perform a measurement during each conversion period or cycle, which is selectable by programming the conversion rate register. l2 kT V BE = n x ------ x ln ---- l1 q Where: n = diode ideality factor k = Boltzmann's constant T = absolute temperature (K) = 273 C + T (C) q = electron charge ln = natural logarithm l2, l1 = two source currents Because the device does not directly convert the sensed VBE as in the old method of temperature measurement systems, the VBE calibration is not required. Furthermore, the device remote temperature error is adjusted at the manufacturer to meet the specifications with the use of the reference diode-connected transistors such as the 2N3904/2N3906. The diode type to be used in customer applications must have the characteristics as close to the 2N3904/2N3906 as possible in order to obtain optimal results. Finally, to prevent the effects of system noise on the measured VBE signals, an external capacitor of about 2200 pF connected between the D+ and D- pins as well as the grounded-shield cable for the diode connection wires are recommended. (1)
7.9.5 Diode fault detection
The SA56004X is designed with circuitry to detect the fault conditions of the remote diode. When the D+ pin is shorted to VDD or floating, the Remote Temperature High Byte (RTHB) register is loaded with +127 C, the Remote Temperature Low Byte (RTLB) register is loaded with 0 C, and the OPEN bit (bit 2 of the Status register) is set. Under the above conditions of D+ shorted to VDD or floating, if the Remote T_CRIT setpoint is set less than +127 C, and T_CRIT Mask are disabled, then, the T_CRIT output pins will be pulled
SA56004X_5
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Product data sheet
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NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
LOW. Furthermore, if the Remote HIGH Setpoint High Byte (RHSHB) register is set to a value less than +127 C and the Alert Mask is disabled, then the ALERT output will be pulled LOW. Note that the OPEN bit itself will not trigger an ALERT. When the D+ pin is shorted to ground or to D-, the Remote Temperature High Byte (RTHB) register is loaded with -128 C (1000 0000) and the OPEN (bit 2 in the Status register) will not be set. Since operating the SA56004X is beyond its normal limits, this temperature reading represents this shorted fault condition. If the value in the Remote Low Setpoint High Byte (RLSHB) register is more than -128 C and the Alert Mask is disabled, the ALERT output will be pulled LOW.
7.10 SMBus interface
The device can communicate over a standard two-wire serial interface System Management Bus (SMBus) or compatible I2C-bus using SCLK and SDATA. The device employs four standard SMBus protocols: Write Byte, Read Byte, Receive Byte, and Send Byte. Data formats of four protocols are shown in Figure 9. The following key points of protocol are important:
* The SMBus master initiates data transfer by establishing a START condition (S) and
terminates data transfer by generating a STOP condition (P).
* Data is sent over the serial bus in sequences of 9 clock pulses according to each 8-bit
data byte followed by 1-bit status of device acknowledgement (A).
* The 7-bit slave address is equivalent to factory-programmed address of the device. * The command byte is equivalent to the address of the selected device register. * The Receive Byte format is used for quicker transfer data from a device reading
register that was previously selected.
SA56004X_5
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 -- 22 May 2008
18 of 36
NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
1 SCLK SDATA S START 1 SCLK SDATA D7 a6
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9 (cont.)
a5
a4
a3
a2
a1
a0 W A
D7
D6
D5
D4
D3
D2
D1
D0 A
(cont.)
device address 2 3 4 5 6 7 8 9
device register command
D6
D5
D4
D3
D2
D1
D0 A P STOP
002aad219
data to be written to register
a. Write Byte format (to write a data byte to the device register)
1 SCLK SDATA S START 1 SCLK SDATA S RESTART device address a6 a5 a4 a3 a2 a1 a0 R A data from device register D7 D6 D5 D4 D3 D2 D1 D0 NA P STOP
002aad220
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9 (cont.)
a6
a5
a4
a3
a2
a1
a0 W A
D7
D6
D5
D4
D3
D2
D1
D0 A P STOP
(cont.)
device address 2 3 4 5 6 7 8 9 1 2
device register command 3 4 5 6 7 8 9
b. Read Byte format (to read a data byte from the device register)
1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9
SCLK SDATA
(cont.) (cont.) S RESTART
a6
a5
a4
a3
a2
a1
a0 R A
D7
D6
D5
D4
D3
D2
D1
D0 NA P STOP
002aad221
device address
data from device register
c. Receive Byte format (to read a data byte from already pointed register)
1 SCLK SDATA S START device address a6 a5 a4 a3 a2 a1 a0 W A device register command D7 D6 D5 D4 D3 D2 D1 D0 A P STOP
002aad222
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
d. Send Byte format Fig 9. SMBus interface protocols
SA56004X_5
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 -- 22 May 2008
19 of 36
NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
7.10.1 Serial interface reset
If the SMBus master attempts to reset the SA56004X while the SA56004X is controlling the data line and transmitting on the data line, the SA56004X must be returned to a known state in the communication protocol. This may be accomplished in two ways: 1. When the SDATA is LOW, the SA56004X SMBus state machine resets to the SMBus idle state if SCLK is held LOW for more than 35 ms (maximum TIMEOUT period). According to SMBus specification 2.0, all devices are required to time-out when the SCLK line is held LOW for 25 ms to 35 ms. Therefore, to insure a time-out of all devices on the bus, the SCLK line must be held LOW for at least 35 ms. 2. When the SDATA is HIGH, the master initiates an SMBus START. The SA56004X will respond properly to a SMBus START condition only during the data retrieving cycle. After the START, the SA56004X will expect an SMBus Address byte.
8. Simplified system diagram
VDD
R 10 k R 10 k R 10 k
1
100 nF
VDD
SCLK
8
CLOCK
VDD
SA56004X
shielded twisted pair
2.2 nF(1)
SMBus CONTROLLER 7 DATA
2
D+
SDATA
3
remote sensor 2N3904 (NPN), 2N3906 (PNP), or similar standalone, ASIC or microprocessor thermal diode
D-
ALERT
6
INT
VDD
R 10 k
+5 V
4
T_CRIT
GND
5
FAN CONTROL CIRCUIT
002aad201
(1) Typical value; placed close to temperature sensor.
Fig 10. Simplified system diagram
SA56004X_5
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Product data sheet
Rev. 05 -- 22 May 2008
20 of 36
NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
9. Limiting values
Table 17. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND. Symbol VDD VD+ VD- Isink ID+ Vesd Tj(max) Tstg
[1]
Parameter supply voltage voltage at SDATA, SCLK, ALERT, T_CRIT voltage at positive diode input voltage at negative diode input sink current D+ input current electrostatic discharge voltage maximum junction temperature storage temperature
Conditions
Min -0.3 -0.3 -0.3 -0.3
Max +6 +6 VDD + 0.3 +0.8 +50 +1 2000 200 +150 +165
Unit V V V V mA mA V V C C
SDATA, SCLK, ALERT, T_CRIT Human Body Model Machine Model
[1] [1]
-1 -1 -65
The D+ and D- pins are 1000 V HBM and 100 V MM due to the higher sensitivity of the analog pins that introduces a limitation to the circuit protection structure.
SA56004X_5
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Product data sheet
Rev. 05 -- 22 May 2008
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NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
10. Characteristics
Table 18. Electrical characteristics VDD = 3.0 V to 3.6 V; Tamb = -40 C to +125 C; unless otherwise specified. Symbol TERRL TERRR Parameter local temperature error remote temperature error Conditions Tamb = +60 C to +100 C Tamb = -40 C to +125 C Tamb = +25 C to +85 C; TRD = +60 C to +100 C Tamb = -40 C to +85 C; TRD = -40 C to +125 C TRESR TRESL Tconv VDD IDD remote temperature resolution local temperature resolution conversion period supply voltage quiescent current shut-down current IRD UVL remote diode source current UnderVoltage Lockout (UVL) threshold voltage[2] Power-On Reset (POR) threshold voltage during conversion, 16 Hz conversion rate SMBus inactive high setting: D+ - D- = +0.65 V low setting VDD input disables A/D conversion VDD input falling edge
[3] [1]
Min -2 -3 -1 -3 3.0 2.6 1.8 -
Typ 1 11 0.125 11 0.125 38 500 10 160 10 +70 0 +85 +10 -
Max +2 +3 +1 +3 5.5 2.95 2.4 0.4
Unit C C C C bit C bit C ms V A A A A V V C C C C V
[4]
local and remote ALERT high default values set at power-up default temperature settings local and remote ALERT low default temperature settings local and remote T_CRIT default temperature settings T_CRIT hysteresis ALERT and T_CRIT output saturation voltage
[1] [2]
default values set at power-up default values set at power-up default value set at power-up IO = 6.0 mA
The SA56004X is optimized for 3.3 V VDD operation. Definition of Under Voltage Lockout (UVL): The value of VDD below which the internal A/D converter is disabled. This is designed to be a minimum of 200 mV above the power-on reset. During the time that it is disabled, the temperature that is in the `read temperature registers' will remain at the value that it was before the A/D was disabled. This is done to eliminate the possibility of reading unexpected false temperatures due to the A/D converter not working correctly due to low voltage. In case of power-up (rising VDD), the reading that is stored in the `read temperature registers' will be the default value of 0 C. VDD will rise to the value of the UVL, at which point the A/D will function correctly and the normal temperature will be read. VDD (rising edge) voltage below which the A/D converter is disabled. VDD (falling edge) voltage below which the logic is reset.
[3] [4]
SA56004X_5
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 -- 22 May 2008
22 of 36
NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
Table 19. SMBus interface characteristics VDD = 3.0 V to 3.6 V; Tamb = -40 C to +125 C; unless otherwise specified. These specifications are guaranteed by design and not tested in production. Symbol VIH VIL IOL IOH IIL IIH Ci fSCLK tLOW tHIGH tBUF tHD;STA tHD;DAT tSU;DAT tSU;STA tSU;STO tr tf tof tto(SMBus)
[1]
Parameter HIGH-level input voltage LOW-level input voltage LOW-level output current LOW-level output current LOW-level input current HIGH-level input current input capacitance SCLK operating frequency SCLK LOW time SCLK HIGH time SMBus free time[2] hold time of START condition[3] hold time of data[4] in[5] set-up time of data
Conditions SCLK, SDATA; VDD = 2.7 V to 5.5 V SCLK, SDATA; VDD = 2.7 V to 5.5 V ALERT, T_CRIT; VOL = 0.4 V SDATA; VOL = 0.6 V
Min 2.2 1.0 6.0 -1.0 -
Typ 5 5000 5000 300 -
Max 0.8 1.0 1.0 400 1 300 250 35
Unit V V mA mA A A A pF kHz ns ns ns ns ns ns ns ns s ns ns ms
SCLK, SDATA
-
SMBus digital switching characteristics[1] 10 % to 10 % 90 % to 90 % 10 % of SDATA to 90 % of SCLK 600 600 600 600 0 250 90 % to 90 % 250 250 25
set-up time of repeat START condition[6] rise time fall time output fall time SMBus time-out time[8]
set-up time of STOP condition[7] 90 % of SCLK to 90 % of SDATA SCLK and SDATA SCLK and SDATA CL = 400 pF; IO = 3 mA
The switching characteristics of the SA56004X fully meet or exceed all parameters specified in SMBus version 2.0. The following parameters specify the timing between the SCLK and SDATA signals in the SA56004X. They adhere to, but are not necessarily specified as the SMBus specifications. Delay from SDATA STOP to SDATA START. Delay from SDATA START to first SCLK HIGH-to-LOW transition. Delay from SCLK HIGH-to-LOW transition to SDATA edges. Delay from SDATA edges to SCLK LOW-to-HIGH transition. Delay from SCLK LOW-to-HIGH transition to restart SDATA. Delay from SCLK HIGH-to-LOW transition to SDATA STOP condition. LOW period for reset of SMBus.
[2] [3] [4] [5] [6] [7] [8]
SA56004X_5
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Product data sheet
Rev. 05 -- 22 May 2008
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NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
tr tLOW SCLK tHD;DAT tHD;STA SDATA tBUF P S tHIGH
tf tHD;STA
tSU;STA
tSU;STO
tSU;DAT
S
P
002aad237
Fig 11. Timing measurements
SA56004X_5
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Product data sheet
Rev. 05 -- 22 May 2008
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NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
11. Performance curves
002aad228 002aad229
24 IDD shutdown (A) 16
VDD = 5.5 V 3.6 V 3.3 V 3.0 V
800 IDD quiescent (A) 600
VDD = 5.5 V 3.6 V 3.3 V 3.0 V
8
400
0 -50
-25
0
25
50
75
125 100 Tamb (C)
200 -50
-25
0
25
50
75
125 100 Tamb (C)
Fig 12. Typical IDD shutdown versus temperature and VDD
400 IDD quiescent (A) 300
002aad230
Fig 13. Typical IDD quiescent current versus temperature and VDD (conversion rate = 16 Hz)
500 IDD quiescent (A) 400
(2)
002aad231
(1)
VDD = 5.5 V 3.6 V 3.3 V 3.0 V
300 200 200
(5) (6) (7)
(3) (4)
(8) (9)
100 -50
-25
0
25
50
75
125 100 Tamb (C)
100 -50
-25
0
25
50
75
125 100 Tamb (C)
Conversion rate: (1) 16 Hz (2) 8.0 Hz (3) 4.0 Hz (4) 2.0 Hz (5) 1.0 Hz (6) 0.5 Hz (7) 0.25 Hz (8) 0.12 Hz (9) 0.06 Hz
Fig 14. Typical IDD quiescent current versus temperature and VDD (conversion rate = 0.06 Hz)
Fig 15. Typical IDD quiescent current versus temperature and conversion rate (VDD = 3.3 V)
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Product data sheet
Rev. 05 -- 22 May 2008
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NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
14 IOL (mA) 10 VDD = 5.5 V 3.6 V 3.3 V 3.0 V
002aad232
10 IOL (mA) 8 VDD = 5.5 V 3.6 V 3.3 V 3.0 V
002aad234
6
6
2 -50
-25
0
25
50
75
125 100 Tamb (C)
4 -50
-25
0
25
50
75
125 100 Tamb (C)
Fig 16. Typical T_CRIT IOL versus temperature and VDD (VOL = 0.4 V)
2.80 UVL (V) 2.78
002aad233
Fig 17. Typical ALERT IOL versus temperature and VDD (VOL = 0.4 V)
2.6 VPOR (V) 2.2
002aad235
2.76 1.8 2.74 VDD = 5.5 V 3.6 V 3.3 V 3.0 V -25 0 25 50 75 125 100 Tamb (C) 1.4
2.72
2.70 -50
1.0 -50
-25
0
25
50
75
125 100 Tamb (C)
Fig 18. Typical UVL versus temperature and VDD
Fig 19. Typical VPOR versus temperature
SA56004X_5
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Product data sheet
Rev. 05 -- 22 May 2008
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NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
12. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
D
E
A X
c y HE vMA
Z 8 5
Q A2 A1 pin 1 index Lp 1 e bp 4 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03 JEDEC MS-012 JEITA EUROPEAN PROJECTION A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
0.010 0.057 0.004 0.049
0.019 0.0100 0.014 0.0075
0.244 0.039 0.028 0.041 0.228 0.016 0.024
8o o 0
ISSUE DATE 99-12-27 03-02-18
Fig 20. Package outline SOT96-1 (SO8)
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Product data sheet
Rev. 05 -- 22 May 2008
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NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
D
E
A
X
c y HE vMA
Z
8
5
A2 pin 1 index
A1
(A3)
A
Lp L
1
e bp
4
detail X wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.45 0.25 c 0.28 0.15 D(1) 3.1 2.9 E(2) 3.1 2.9 e 0.65 HE 5.1 4.7 L 0.94 Lp 0.7 0.4 v 0.1 w 0.1 y 0.1 Z(1) 0.70 0.35 6 0
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT505-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-04-09 03-02-18
Fig 21. Package outline SOT505-1 (TSSOP8)
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Product data sheet
Rev. 05 -- 22 May 2008
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NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm
SOT782-1
0
1 scale
2 mm
X D B A
A terminal 1 index area E
A1 c
detail X
terminal 1 index area 1 L
e1 e b 4 vM C A B wM C
C y1 C y
Eh
8 Dh DIMENSIONS (mm are the original dimensions) UNIT mm A (1) max. 1 A1 0.05 0.00 b 0.35 0.25 c 0.2 D (1) 3.1 2.9 Dh 2.55 2.25 E (1) 3.1 2.9
5
Eh 1.75 1.45
e 0.65
e1 1.95
L 0.5 0.3
v 0.1
w 0.05
y 0.05
y1 0.1
Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT782-1 REFERENCES IEC --JEDEC MO-229 JEITA --EUROPEAN PROJECTION ISSUE DATE 03-01-29
Fig 22. Package outline SOT782-1 (HVSON8)
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Product data sheet
Rev. 05 -- 22 May 2008
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NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
13. Packing information
The SA56004X is packed in reels, as shown in Figure 23.
tape guard band reel assembly tape detail cover tape
carrier tape
barcode label
box
002aad226
Fig 23. Tape and reel packing method
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount reflow soldering description".
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:
* Through-hole components * Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
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SA56004X
Digital temperature sensor with overtemperature alarms
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are:
* * * * * *
Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
* Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are exposed to the wave
* Solder bath specifications, including temperature and impurities 14.4 Reflow soldering
Key characteristics in reflow soldering are:
* Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 24) than a SnPb process, thus reducing the process window
* Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
* Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 20 and 21
Table 20. SnPb eutectic process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 2.5 2.5
SA56004X_5
Package thickness (mm)
350 220 220
(c) NXP B.V. 2008. All rights reserved.
235 220
Product data sheet
Rev. 05 -- 22 May 2008
31 of 36
NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
Lead-free process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 260 250 245 > 2000 260 245 245
Table 21.
Package thickness (mm)
< 1.6 1.6 to 2.5 > 2.5
260 260 250
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 24.
temperature
maximum peak temperature = MSL limit, damage level
minimum peak temperature = minimum soldering temperature
peak temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 24. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description".
15. Mounting
15.1 Printed-circuit board layout considerations
Care must be taken in Printed-Circuit Board (PCB) layout to minimize noise induced at the remote temperature sensor inputs, especially in extremely noisy environments, such as a computer motherboard. Noise induced in the traces running between the device sensor inputs and the remote diode can cause temperature conversion errors. Typical sensor signal levels to the SA56004X is a few microvolts. The following guidelines are recommended: 1. Place the SA56004X as close as possible to the remote sensor. It can be from 4 inches to 8 inches, as long as the worst noise sources such as clock generator, data and address buses, CRTs are avoided.
SA56004X_5 (c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 -- 22 May 2008
32 of 36
NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
2. Route the D+ and D- lines parallel and close together with ground guards enclosing them (see Figure 25). 3. Leakage currents due to printed-circuit board contamination must be considered. Error can be introduced by these leakage currents. 4. Use wide traces to reduce inductance and noise pick-up. Narrow traces more readily pick up noise. The minimum width of 10 mil and space of 10 mil are recommended. 5. Place a bypass capacitor of 10 nF close to the VDD pin and an input filter capacitor of 2200 pF close to the D+ and D- pins. 6. A shielded twisted pair is recommended if remote sensor is located several feet away from the temperature sensor. Under this circumstance, connect the shield of the cable at the device side to the SA56004X GND pin and leave the shield at the remote end unconnected to avoid ground loop currents. Also notice that the series resistance of the cable may introduce measurement error; 1 can introduce about 0.5 C.
GND D+ D- GND
002aad227
Fig 25. D+ and D- trace layout
16. Abbreviations
Table 22. Acronym A/D ARA ASIC CRT ESD HBM HVAC I2C-bus LSB MM MSB OTP POR PTAT SMBus UVL Abbreviations Description Analog-to-Digital Alert Response Address Application Specific Integrated Circuit Cathode Ray Tube ElectroStatic Discharge Human Body Model Heating, Ventilating and Air Conditioning Inter-Integrated Circuit bus Least Significant Bit Machine Model Most Significant Bit One-Time Programmable Power-On Reset Proportional To Absolute Temperature System Management Bus Under Voltage Lockout
SA56004X_5
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 -- 22 May 2008
33 of 36
NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
17. Revision history
Table 23. Revision history Release date 20080522 Data sheet status Product data sheet Change notice Supersedes SA56004X_4 Document ID SA56004X_5 Modifications:
* * * * *
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Added HVSON8 package option Table 17 "Limiting values": removed "P, power dissipation" specification from this table Table 19 "SMBus interface characteristics": - descriptions of parameters moved to table notes - tLOW: Min changed from "4.7 s" to "600 ns"; Typ changed from "5.0 s" to "5000 ns" - tHIGH: Min changed from "4.0 s" to "600 ns"; Typ changed from "5.0 s" to "5000 ns" - tBUF: Min changed from "4.7 s" to "600 ns" - tHD;STA: Min changed from "4.0 s" to "600 ns" - tHD;DAT: Min changed from "-" to "0 ns" - tSU;STO: Min changed from "4.0 s" to "250 ns" - symbol "tTIMEOUT, SMBus TIMEOUT" changed to "tto(SMBus), SMBus time-out time"
SA56004X_4 SA56004X_3 (9397 750 13841) SA56004X_2 (9397 750 12015) SA56004-X_1 (9397 750 10993)
20060808 20041006 20030903 20030819
Product data sheet Product data sheet Objective data Objective data
-
SA56004X_3 SA56004X_2 SA56004-X_1 -
SA56004X_5
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 -- 22 May 2008
34 of 36
NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
18. Legal information
18.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
18.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus -- logo is a trademark of NXP B.V.
19. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
SA56004X_5
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 -- 22 May 2008
35 of 36
NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
20. Contents
1 2 3 4 4.1 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.8.1 7.8.2 7.8.3 7.8.4 7.8.5 7.8.6 7.8.7 7.8.8 7.8.9 7.8.10 7.9 7.9.1 7.9.1.1 7.9.1.2 7.9.1.3 7.9.2 7.9.3 7.9.4 7.9.5 7.10 7.10.1 8 9 10 11 12 13 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Serial bus interface . . . . . . . . . . . . . . . . . . . . . . 5 Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Register overview . . . . . . . . . . . . . . . . . . . . . . . 5 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 6 Starting conversion . . . . . . . . . . . . . . . . . . . . . . 7 Low power software standby mode . . . . . . . . . 7 Temperature data format . . . . . . . . . . . . . . . . . 7 SA56004X SMBus registers . . . . . . . . . . . . . . . 8 Command register . . . . . . . . . . . . . . . . . . . . . . 8 Local and remote temperature registers (LTHB, LTLB, RTHB, RTLB) . . . . . . . . . . . . . . . 8 Configuration register (CON) . . . . . . . . . . . . . . 8 Status register (SR) . . . . . . . . . . . . . . . . . . . . . 9 Conversion rate register (CR) . . . . . . . . . . . . . 10 Temperature limit registers . . . . . . . . . . . . . . . 10 Programmable offset register (remote only) . . 11 ALERT mode register (AM) . . . . . . . . . . . . . . 11 Other registers . . . . . . . . . . . . . . . . . . . . . . . . 11 One-shot register . . . . . . . . . . . . . . . . . . . . . . 11 Interruption logic and functional description . . 12 ALERT output . . . . . . . . . . . . . . . . . . . . . . . . . 12 ALERT output in comparator mode . . . . . . . . 12 ALERT output in interrupt mode . . . . . . . . . . . 12 ALERT output in SMBus ALERT mode . . . . . 13 T_CRIT output . . . . . . . . . . . . . . . . . . . . . . . . 15 Fault Queue . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Remote diode selection . . . . . . . . . . . . . . . . . 17 Diode fault detection . . . . . . . . . . . . . . . . . . . . 17 SMBus interface . . . . . . . . . . . . . . . . . . . . . . . 18 Serial interface reset. . . . . . . . . . . . . . . . . . . . 20 Simplified system diagram . . . . . . . . . . . . . . . 20 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 21 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 22 Performance curves . . . . . . . . . . . . . . . . . . . . 25 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 27 Packing information. . . . . . . . . . . . . . . . . . . . . 30 14 14.1 14.2 14.3 14.4 15 15.1 16 17 18 18.1 18.2 18.3 18.4 19 20 Soldering of SMD packages . . . . . . . . . . . . . . Introduction to soldering. . . . . . . . . . . . . . . . . Wave and reflow soldering . . . . . . . . . . . . . . . Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Printed-circuit board layout considerations . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 30 30 31 31 32 32 33 34 35 35 35 35 35 35 36
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 22 May 2008 Document identifier: SA56004X_5

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